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THE ALGORITHM TO IMPROVE THE PROCESSABILITY OF MAKING MULTILAYER PRINTED CIRCUIT BOARDS

I. V. Drozhzhin, Head of Department "Printed Circuit Boards", JSC "Ryazan State Instrument-Making Enterprise", Ryazan; This email address is being protected from spambots. You need JavaScript enabled to view it.

The article proposes the algorithm to improve the processability of making multi-layer printed circuit boards with a method of reducing the density interconnections. The aim is to make full automation of creating multi-layer PCB with a high degree of integration of the topological pattern on the stage of automated design and technological design by moving the vias under IC chip directly below the findings and technology for manufacturing multilayer printed circuit board according to the method above. The results of this work will help to place the electrical circuit on the printed circuit board with smaller dimensions, use a BGA chip with a smaller step, to reduce the plies of PCB, to improve the reliability of interconnections, avoid short circuits during installation of planar circuits and BGA chip.

Keywords: printed circuit board, density interconnect, chip, via, pad, build-up, Silting holes.

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